Description
This silicone gap pad is designed for battery module interfaces where the gap varies and the assembly needs a compliant thermal path. The soft silicone construction conforms to minor surface imperfections and helps distribute clamp pressure across the cell or cold plate.
Available in a range of thicknesses and thermal conductivities, the pad can be supplied with or without a reinforcing carrier. Selection depends on dielectric requirements, compression set, and the force available in the module design.
Typical uses include prismatic cell cooling, power electronics, and enclosure heat spreading. Request a sample with the intended thickness and adhesive option, then validate thermal impedance in the real stack.